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Product DetailSpecification/Dimensions
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Wire diameter(φ/mm)
- 0.3
- 0.6
- 1.0
Days to Ship
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- All
- 6 Day(s) or Less
Specify Alterations
Lead-free Solder, Sn 99.3% / Cu + Ni 0.7% (HS-372)
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- Starting From :
- 1,550₹/Unit
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Product DetailProduct Description
Lead Free Solder/Flux Characteristics: RMA Composition: Sn 99.3% / Cu+Ni0.7%
[Features]
· Lead free solder with a glossy finish close to that of tin-lead solder.
· Solder with comparatively low rates of copper leaching and soldering iron tip damage.
Basic Information
| Type | Bobbin type M | Lead Free | Corresponds to |
|---|
Please check the type/dimensions/specifications of the part HS-372 in the Lead-free Solder, Sn 99.3% / Cu + Ni 0.7% series.
- The specifications and dimensions of some parts may not be fully covered. For exact details, refer to manufacturer catalogs .
Product variants
| Part Number |
|---|
| HS-371 |
| HS-374 |
| Part Number | Standard Unit Price | Minimum order quantity | Volume Discount | Days to Ship | RoHS | Wire diameter (φ/mm) |
|---|---|---|---|---|---|---|
₹ 2,245.18 | 1 Piece(s) | 6 Day(s) or more | 10 | 0.3 | ||
₹ 1,550.04 | 1 Piece(s) | 6 Day(s) or more | 10 | 1.0 |
Payment Method
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- UPI
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- Cheque on delivery
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- Online payment
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