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Product DetailLead Free Solder, Sn96.5% / Ag3% / Cu0.5% (HS-361)
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Product Detail
Product Description
Lead free solder. Uses JEITA recommended alloys.
[Features]
· Features low-spatter flux.
· A JEITA recommended alloy lead free solder. Highly reliable and with a proven track record.
Basic Information
| Lead Free | Corresponds to | Material | Sn96.5%/Ag3%/Cu0.5% |
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Please check the type/dimensions/specifications of the part HS-361 in the Lead Free Solder, Sn96.5% / Ag3% / Cu0.5% series.
- The specifications and dimensions of some parts may not be fully covered. For exact details, refer to manufacturer catalogs .
Product variants
| Part Number |
|---|
| HS-304 |
| HS-312 |
| HS-313 |
| HS-314 |
| HS-362 |
| HS-363 |
| Part Number | Standard Unit Price | Minimum order quantity | Volume Discount | Days to Ship | RoHS | Type | Wire diameter (φ/mm) |
|---|---|---|---|---|---|---|---|
₹ 2,071.05 | 1 Piece(s) | 6 Day(s) or more | 10 | Bobbin type M | 1.0 | ||
₹ 8,081.95 | 1 Piece(s) | 6 Day(s) or more | 10 | Bobbin type L | 0.6 | ||
₹ 7,436.36 | 1 Piece(s) | 6 Day(s) or more | 10 | Bobbin type L | 0.8 | ||
₹ 6,915.35 | 1 Piece(s) | 6 Day(s) or more | 10 | Bobbin type L | 1.0 | ||
₹ 1,012.15 | 1 Piece(s) | 6 Day(s) or more | 10 | Bobbin type S | 0.8 | ||
₹ 988.22 | 1 Piece(s) | 6 Day(s) or more | 10 | Bobbin type S | 1.0 |
| Part Number |
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